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1 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 mx25l6436e/MX25L12836E high performance serial flash specification
2 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 contents features .................................................................................................................................................................. 5 general description ......................................................................................................................................... 7 table 1. additional features .............................................................................................................................. 7 pin configuration ................................................................................................................................................ 8 pin description ...................................................................................................................................................... 8 block diagram ....................................................................................................................................................... 9 data protection .................................................................................................................................................. 1 0 table 2. protected area sizes .......................................................................................................................... 1 1 table 3. 4k-bit secured otp defnition ............................................................................................................ 1 1 memory organization ............................................................................................................................................... 1 2 table 4-1. memory organization for mx25l6436e ......................................................................................... 1 2 table 4-2. memory organization for MX25L12836E ....................................................................................... 1 3 device operation ................................................................................................................................................ 1 4 figure 1. serial modes supported (for normal serial mode) ........................................................................... 1 4 command description ....................................................................................................................................... 1 5 table 5. command sets ................................................................................................................................... 1 5 (1) write enable (wren) ................................................................................................................................. 1 7 (2) write disable (wrdi) .................................................................................................................................. 1 7 (3) read identifcation (rdid) .......................................................................................................................... 1 7 (4) read status register (rdsr) .................................................................................................................... 1 8 (5) write status register (wrsr) .................................................................................................................... 1 9 protection modes ............................................................................................................................................. 1 9 (6) read data bytes (read) ........................................................................................................................... 2 0 (7) read data bytes at higher speed (fast_read) ..................................................................................... 2 0 (8) dual read mode (dread) ......................................................................................................................... 2 0 (9) quad read mode (qread) ....................................................................................................................... 2 0 (10) sector erase (se) ..................................................................................................................................... 2 1 (11) block erase (be) ....................................................................................................................................... 2 1 (12) block erase (be32k) ................................................................................................................................ 2 1 (13) chip erase (ce) ........................................................................................................................................ 2 2 (14) page program (pp) ................................................................................................................................... 2 2 (15) 4 x i/o page program (4pp) ..................................................................................................................... 2 3 program/erase flow(1) with read array data ................................................................................................... 2 4 program/erase flow(2) without read array data .............................................................................................. 2 5 (16) continuously program mode (cp mode) .................................................................................................. 2 6 (17) parallel mode (highly recommended for production throughputs increasing) .......................................... 2 6 (18) deep power-down (dp) ............................................................................................................................ 2 7 (19) release from deep power-down (rdp), read electronic signature (res) ............................................ 2 7 (20) read electronic manufacturer id & device id (rems), (rems2), (rems4) .......................................... 2 7 table 6. id defnitions ..................................................................................................................................... 2 8 (21) enter secured otp (enso) ..................................................................................................................... 2 8 (22) exit secured otp (exso) ........................................................................................................................ 2 8 (23) read security register (rdscur) .......................................................................................................... 2 8 security register defnition .............................................................................................................................. 2 9
3 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (24) write security register (wrscur) .......................................................................................................... 2 9 (25) write protection selection (wpsel) ......................................................................................................... 3 0 bp and srwd if wpsel=0 ............................................................................................................................. 3 0 the individual block lock mode is effective after setting wpsel=1 ................................................................. 3 1 wpsel flow .................................................................................................................................................... 3 2 (26) single block lock/unlock protection (sblk/sbulk) ............................................................................... 3 3 block lock flow ............................................................................................................................................... 3 3 block unlock flow ............................................................................................................................................ 3 4 (27) read block lock status (rdblock) ....................................................................................................... 3 5 (28) gang block lock/unlock (gblk/gbulk) ................................................................................................. 3 5 (29) clear sr fail flags (clsr) ...................................................................................................................... 3 5 (30) enable so to output ry/by# (esry) ...................................................................................................... 3 5 (31) disable so to output ry/by# (dsry) ..................................................................................................... 3 5 (32) read cfi mode (rdcfi) .......................................................................................................................... 3 6 power-on state ................................................................................................................................................... 3 7 electrical specifications .............................................................................................................................. 3 8 absolute maximum ratings ................................................................................................................... 3 8 figure 2. maximum negative overshoot waveform ........................................................................................ 3 8 capacitance ta = 25 c, f = 1.0 mhz ........................................................................................................... 3 8 figure 3. maximum positive overshoot waveform .......................................................................................... 3 8 figure 4. output loading ......................................................................................................................... 3 9 table 7-1. mx25l6436e dc characteristics ......................................................................................... 4 0 table 7-2. MX25L12836E dc characteristics ....................................................................................... 4 1 table 8-1. mx25l6436e ac characteristics ........................................................................................ 4 2 table 8-2. MX25L12836E ac characteristics ...................................................................................... 4 3 timing analysis ........................................................................................................................................................ 4 5 figure 5. serial input timing ............................................................................................................................ 4 5 figure 6. output timing .................................................................................................................................... 4 5 figure 7. wp# setup timing and hold timing during wrsr when srwd=1 ................................................. 4 6 figure 8. write enable (wren) sequence (command 06) ............................................................................. 4 6 figure 9. write disable (wrdi) sequence (command 04) .............................................................................. 4 6 figure 10. read identifcation (rdid) sequence (command 9f) .................................................................... 4 7 figure 11. read status register (rdsr) sequence (command 05) .............................................................. 4 7 figure 12. write status register (wrsr) sequence (command 01) ............................................................. 4 7 figure 13. read data bytes (read) sequence (command 03) .................................................................... 4 8 figure 14. read at higher speed (fast_read) sequence (command 0b) ................................................ 4 8 figure 15. dual read mode sequence (command 3b) ................................................................................... 4 8 figure 16. quad read mode sequence (command 6b) ................................................................................. 4 9 figure 17. sector erase (se) sequence (command 20) ................................................................................ 4 9 figure 18. block erase (be/eb32k) sequence (command d8/52) ................................................................ 4 9 figure 19. chip erase (ce) sequence (command 60 or c7) ......................................................................... 5 0 figure 20. page program (pp) sequence (command 02) .............................................................................. 5 0 figure 21. 4 x i/o page program (4pp) sequence (command 38) ................................................................ 5 0 figure 22. continuously program (cp) mode sequence with hardware detection (command ad) ............... 5 1 figure 23-1. enter parallel mode (enplm) sequence (command 55) .......................................................... 5 2 figure 23-2. exit parallel mode (explm) sequence (command 45) ............................................................. 5 2
4 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 23-3. parallel mode read identifcation (parallel rdid) sequence (command 9f) ........................... 5 2 figure 23-4. parallel mode read electronic manufacturer & device id (parallel rems) sequence (command 90) .................................................................................................................................................................... 5 3 figure 23-5. parallel mode release from deep power-down (rdp) and read electronic signature (res) sequence ......................................................................................................................................................... 5 3 figure 23-6. parallel mode read array (parallel read) sequence (command 03) ...................................... 5 4 figure 23-7. parallel mode page program (parallel pp) sequence (command 02) ...................................... 5 4 figure 24. deep power-down (dp) sequence (command b9) ....................................................................... 5 4 figure 25. release from deep power-down and read electronic signature (res) sequence (command ab) ......................................................................................................................................................................... 5 5 figure 26. release from deep power-down (rdp) sequence (command ab) ............................................. 5 5 figure 27. read electronic manufacturer & device id (rems) sequence (command 90 or ef or df or cf) .. ......................................................................................................................................................................... 5 6 figure 28. write protection selection (wpsel) sequence (command 68) .................................................... 5 6 figure 29. single block lock/unlock protection (sblk/sbulk) sequence (command 36/39) ..................... 5 7 figure 30. read block protection lock status (rdblock) sequence (command 3c) ................................ 5 7 figure 31. gang block lock/unlock (gblk/gbulk) sequence (command 7e/98) ...................................... 5 7 figure 32. power-up timing ............................................................................................................................. 5 8 table 9. power-up timing ............................................................................................................................... 5 8 initial delivery state ............................................................................................................................... 5 8 recommended operating conditions ......................................................................................................... 5 9 erase and programming performance .................................................................................................... 6 0 data retention .................................................................................................................................................... 6 0 latch-up characteristics .............................................................................................................................. 6 0 ordering information ...................................................................................................................................... 6 1 part name description ..................................................................................................................................... 6 2 package information ........................................................................................................................................ 6 3
5 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 64/128m-bit [x 1/x 2/x 4] cmos mxsmio tm (serial multi i/o) flash memory features general ? serial peripheral interface compatible -- mode 0 and mode 3 ? 64mb: 67,108,864 x 1 bit structure or 33,554,432 x 2 bits (two i/o mode) structure or 16,777,216 x 4 bits (four i/ o mode) structure 128mb: 134,217,728 x 1 bit structure or 67,108,864 x 2 bits (two i/o mode) structure or 33,554,432 x 4 bits (four i/o mode) structure ? 4096 equal sectors with 4k bytes each - any sector can be erased individually ? 512 equal blocks with 32k bytes each - any block can be erased individually ? 256 equal blocks with 64k bytes each - any block can be erased individually ? power supply operation - 2.7 to 3.6 volt for read, erase, and program operations ? latch-up protected to 100ma from -1v to vcc +1v performance ? high performance vcc = 2.7~3.6v - normal read - 50mhz - fast read (normal serial mode) - 1 i/o: 104mhz with 8 dummy cycles - 2 i/o: 70mhz with 4 dummy cycles - 4 i/o: 70mhz with 6 dummy cycles - fast program time: 1.4ms(typ.) and 5ms(max.)/page (256-byte per page) - byte program time: 9us (typical) - continuously program mode (automatically increase address under word program mode) - fast erase time: 60ms (typ.)/sector (4k-byte per sector) ; 0.7s(typ.) /block (64k-byte per block); 50s(typ.) /chip for 64mb, 80s(typ.) /chip for 128mb ? low power consumption - low active read current: 45ma(max.) at 104mhz, 40ma(max.) at 66mhz and 30ma(max.) at 33mhz - low active programming current: 25ma (max.) - low active erase current: 25ma (max.) - low standby current: 100ua (max.) - deep power down current: 128mb is 40ua (max.), 64mb is 30ua (max.) ? typical 100,000 erase/program cycles software features ? input data format - 1-byte command code ? advanced security features
6 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 - bp0-bp3 block group protect - flexible individual block protect when otp wpsel=1 - additional 4k bits secured otp for unique identifer ? auto erase and auto program algorithms - automatically erases and verifes data at selected sector - automatically programs and verifes data at selected page by an internal algorithm that automatically times the program pulse width (any page to be programed should have page in the erased state frst.) ? status register feature ? electronic identifcation - jedec 1-byte manufacturer id and 2-byte device id - res command for 1-byte device id - both rems, rems2 and rems4 commands for 1-byte manufacturer id and 1-byte device id ? support common flash interface (cfi) (tbd) hardware features ? sclk input - serial clock input ? si/so0 - serial data input or serial data multiple output for 2 x i/o mode and 4 x i/o mode ? so/so1/po7 - serial data output or serial data multiple output for 2 x i/o mode and 4 x i/o mode or parallel data ? wp#/so2 - hardware write protection or serial data multiple output for 4 x i/o mode ? nc/so3 - nc pin or serial data multiple output for 4 x i/o mode ? po0~po6 - for parallel mode data (only 128mb provide parallel mode) ? package - 16-pin sop (300mil) only for MX25L12836E - 8-pin sop (200mil) only for mx25l6436e - all pb-free devices are rohs compliant
7 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 table 1. additional features general description mx25l6436e is 67,108,864 bits serial flash memory, which is confgured as 8,388,608 x 8 internally. when it is in two or four i/o mode, the structure becomes 33,554,432 bits x 2 or 16,777,216 bits x 4. MX25L12836E is 134,217,728 bits serial flash memory, which is confgured as 16,777,216 x 8 internally. when it is in two or four i/o mode, the structure becomes 67,108,864 bits x 2 or 33,554,432 bits x 4. the mx25l6436e/12836e features a se - rial peripheral interface and software protocol allowing operation on a simple 3-wire bus. the three bus signals are a clock input (sclk), a serial data input (si), and a serial data output (so). serial access to the device is enabled by cs# input. mx25l6436e/12836e provides high performance read mode, which may latch address and data on both rising and falling edge of clock. by using this high performance read mode, the data throughput may be doubling. moreover, the performance may reach direct code execution, the ram size of the system may be reduced and further saving system cost. mx25l6436e/12836e, mxsmio tm (serial multi i/o) fash memory, provides sequential read operation on whole chip and multi-i/o features. when it is in dual i/o mode, the si pin and so pin become sio0 pin and sio1 pin for address/dummy bits input and data output. when it is in quad i/o mode, the si pin, so pin, wp# pin and nc pin become sio0 pin, sio1 pin, sio2 pin and sio3 pin for address/dummy bits input and data input/output. parallel mode is also provided in this device. it features 8 bit input/output for increasing throughputs. this feature is recommended to be used for factory produc - tion purpose. after program/erase command is issued, auto program/erase algorithms which program/erase and verify the speci - fed page or sector/block locations will be executed. program command is executed on byte basis, or page (256 bytes) basis, or word basis for continuously program mode, and erase command is executes on sector (4k-byte), block (32k-byte/64k-byte), or whole chip basis. to provide user with ease of interface, a status register is included to indicate the status of the chip. the status read command can be issued to detect completion status of a program or erase operation via wip bit. when the device is not in operation and cs# is high, it is put in standby mode and draws less than 100ua dc cur - rent. the mx25l6436e/12836e utilizes macronix's proprietary memory cell, which reliably stores memory contents even after 100,000 program and erase cycles. note 1: only MX25L12836E provide parallel mode. additional features part name protection and security read performance flexible or individual block (or sector) protection 4k-bit secured otp 1 i/o read (104 mhz) dual read (70 mhz) quad read (70 mhz) 8 i/o parallel mode (6 mhz) mx25l6436e MX25L12836E v v v v v v (note 1) additional features part name identifer res (command: ab hex) rems (command: 90 hex) rems2 (command: ef hex) rems4 (command: df hex) rdid (command: 9f hex) mx25l6436e 16 (hex) c2 16 (hex) c2 16 (hex) c2 16 (hex) c2 20 17 (hex) MX25L12836E 17 (hex) c2 17 (hex) c2 17 (hex) c2 17 (hex) c2 20 18 (hex)
8 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 pin configuration pin description 16-pin sop (300mil) for MX25L12836E symbol description cs# chip select si/so0 serial data input / serial data multiple output (for 2xi/o or 4xi/o mode) so/so1/ po7 serial data output (for 1xi/o)/serial data multiple output (for 2xi/o or 4xi/o mode) / parallel data output/input sclk clock input wp#/so2 write protection: connect to gnd or serial data multiple output (for 4xi/o mode) nc/so3 nc pin (not connect) or serial data multiple output (for 4xi/o mode) vcc + 3.3v power supply gnd ground po0~po6 parallel data output/input (po0~po6 can be connected to nc in serial mode), nc on mx25l6436e nc no connection 1 2 3 4 5 6 7 8 nc/so3 vcc nc po2 po1 po0 cs# so/so1/po7 16 15 14 13 12 11 10 9 sclk si/so0 po6 po5 po4 po3 gnd wp#/so2 8-pin sop (200mil) for mx25l6436e 1 2 3 4 cs# so/so1 wp#/so2 gnd vcc nc/so3 sclk si/so0 8 7 6 5
9 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 block diagram address gener ator memor y arr a y p age buff er y -decoder x-decoder data register sram buff er si/so0 sclk so/so1 cloc k gener ator state machine mode logic sense amplifier hv gener ator output buff er cs# wp#/so2 nc/so3
10 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 data protection mx25l6436e/12836e is designed to offer protection against accidental erasure or programming caused by spuri - ous system level signals that may exist during power transition. during power up the device automatically resets the state machine in the standby mode. in addition, with its control register architecture, alteration of the memory contents only occurs after successful completion of specifc command sequences. the device also incorporates several features to prevent inadvertent write cycles resulting from vcc power-up and power-down transition or sys - tem noise. ? valid command length checking: the command length will be checked whether it is at byte base and completed on byte boundary. ? write enable (wren) command: wren command is required to set the write enable latch bit (wel) before other command to change data. the wel bit will return to reset stage under following situation: - power-up - write disable (wrdi) command completion - write status register (wrsr) command completion - page program (pp, 4pp) command completion - continuously program mode (cp) instruction completion - sector erase (se) command completion - block erase (be, be32k) command completion - chip erase (ce) command completion - single block lock/unlock (sblk/sbulk) instruction completion - gang block lock/unlock (gblk/gbulk) instruction completion ? deep power down mode: by entering deep power down mode, the fash device also is under protected from writing all commands except release from deep power down mode command (rdp) and read electronic sig - nature command (res). i. block lock protection - the software protected mode (spm) uses (bp3, bp2, bp1, bp0) bits to allow part of memory to be protected as read only. the protected area defnition is shown as table of "protected area sizes", the protected areas are more fexible which may protect various area by setting value of bp0-bp3 bits. please refer to table of "protect - ed area sizes". - the hardware protected mode (hpm) use wp#/sio2 to protect the (bp3, bp2, bp1, bp0) bits and srwd bit. if the system goes into four i/o mode, the feature of hpm will be disabled. - mx25l6436e/12836e provide individual block (or sector) write protect & unprotect. user may enter the mode with wpsel command and conduct individual block (or sector) write protect with sblk instruction, or sbulk for individual block (or sector) unprotect. under the mode, user may conduct whole chip (all blocks) protect with gblk instruction and unlock the whole chip with gbulk instruction.
11 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 ii. additional 4k-bit secured otp for unique identifer: to provide 4k-bit one-time program area for setting de - vice unique serial number - which may be set by factory or system maker. please refer to table 3. 4k-bit se - cured otp defnition. - security register bit 0 indicates whether the chip is locked by factory or not. - to program the 4k-bit secured otp by entering 4k-bit secured otp mode (with enso command), and going through normal program procedure, and then exiting 4k-bit secured otp mode by writing exso command. - customer may lock-down the customer lockable secured otp by writing wrscur (write security register) command to set customer lock-down bit1 as "1". please refer to table of "security register defnition" for secu - rity register bit defnition and table of "4k-bit secured otp defnition" for address range defnition. - note: once lock-down whatever by factory or customer, it cannot be changed any more. while in 4k-bit se - cured otp mode, array access is not allowed. table 3. 4k-bit secured otp defnition table 2. protected area sizes note: the device is ready to accept a chip erase instruction if, and only if, all block protect (bp3, bp2, bp1, bp0) are 0. address range size standard factory lock customer lock xxx000~xxx00f 128-bit esn (electrical serial number) determined by customer xxx010~xxxfff 3968-bit n/a status bit protection area bp3 bp2 bp1 bp0 64mb 128mb 0 0 0 0 0 (none) 0 (none) 0 0 0 1 1 (2 blocks, block 126th-127th) 1 (2 blocks, block 254th-255th) 0 0 1 0 2 (4 blocks, block 124th-127th) 2 (4 blocks, block 252nd-255th) 0 0 1 1 3 (8 blocks, block 120th-127th) 3 (8 blocks, block 248th-255th) 0 1 0 0 4 (16 blocks, block 112nd-127th) 4 (16 blocks, block 240th-255th) 0 1 0 1 5 (32 blocks, block 96th-127th) 5 (32 blocks, block 224th-255th) 0 1 1 0 6 (64 blocks, block 64th-127th) 6 (64 blocks, block 192nd-255th) 0 1 1 1 7 (128 blocks, all) 7 (128 blocks, block 128th-255th) 1 0 0 0 8 (128 blocks, all) 8 (256 blocks, all) 1 0 0 1 9 (128 blocks, all) 9 (256 blocks, all) 1 0 1 0 10 (128 blocks, all) 10 (256 blocks, all) 1 0 1 1 11 (128 blocks, all) 11 (256 blocks, all) 1 1 0 0 12 (128 blocks, all) 12 (256 blocks, all) 1 1 0 1 13 (128 blocks, all) 13 (256 blocks, all) 1 1 1 0 14 (128 blocks, all) 14 (256 blocks, all) 1 1 1 1 15 (128 blocks, all) 15 (256 blocks, all)
12 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 memory organization table 4-1. memory organization for mx25l6436e block(32k-byte) sector (4k-byte) 2047 7ff000h 7fffffh ? 2040 7f8000h 7f8fffh 2039 7f7000h 7f7fffh ? 2032 7f0000h 7f0fffh 2031 7ef000h 7effffh ? 2024 7e8000h 7e8fffh 2023 7e7000h 7e7fffh ? 2016 7e0000h 7e0fffh 2015 7df000h 7dffffh ? 2008 7d8000h 7d8fffh 2007 7d7000h 7d7fffh ? 2000 7d0000h 7d0fffh 47 02f000h 02ffffh ? 40 028000h 028fffh 39 027000h 027fffh ? 32 020000h 020fffh 31 01f000h 01ffffh ? 24 018000h 018fffh 23 017000h 017fffh ? 16 010000h 010fffh 15 00f000h 00ffffh ? 8 008000h 008fffh 7 007000h 007fffh ? 0 000000h 000fffh 252 251 250 address range 255 254 253 block(64k-byte) 125 2 1 0 127 126 0 5 4 3 2 1 individual block lock/unlock unit:64k-byte individual block lock/unlock unit:64k-byte individual block lock/unlock unit:64k-byte individual 16 sectors lock/unlock unit:4k-byte individual 16 sectors lock/unlock unit:4k-byte
13 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 table 4-2. memory organization for MX25L12836E block(32k-byte) sector 4095 fff000h ffffffh ? 4088 ff8000h ff8fffh 4087 ff7000h ff7fffh ? 4080 ff0000h ff0fffh 4079 fef000h feffffh ? 4072 fe8000h fe8fffh 4071 fe7000h fe7fffh ? 4064 fe0000h fe0fffh 4063 fdf000h fdffffh ? 4056 fd8000h fd8fffh 4055 fd7000h fd7fffh ? 4048 fd0000h fd0fffh 47 02f000h 02ffffh ? 40 028000h 028fffh 39 027000h 027fffh ? 32 020000h 020fffh 31 01f000h 01ffffh ? 24 018000h 018fffh 23 017000h 017fffh ? 16 010000h 010fffh 15 00f000h 00ffffh ? 8 008000h 008fffh 7 007000h 007fffh ? 0 000000h 000fffh 508 507 506 address range 511 510 509 individual block lock/unlock unit:64k-byte individual 16 sectors lock/unlock unit:4k-byte individual block lock/unlock unit:64k-byte individual block lock/unlock unit:64k-byte block(64k-byte) 253 2 1 0 255 254 0 5 4 3 2 1 individual 16 sectors lock/unlock unit:4k-byte
14 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 device operation 1. before a command is issued, status register should be checked to ensure device is ready for the intended op - eration. 2. when incorrect command is inputted to this lsi, this lsi becomes standby mode and keeps the standby mode until next cs# falling edge. in standby mode, so pin of this lsi should be high-z. 3. when correct command is inputted to this lsi, this lsi becomes active mode and keeps the active mode until next cs# rising edge. 4. for standard single data rate serial mode, input data is latched on the rising edge of serial clock (sclk) and data shifts out on the falling edge of sclk. the difference of serial mode 0 and mode 3 is shown as figure 1-1. figure 1. serial modes supported (for normal serial mode) 5. for the following instructions: rdid, rdsr, rdscur, read, fast_read, dread, qread, rdblock, res, rems, rems2, rems4 and rdcfi the shifted-in instruction sequence is followed by a data-out sequence. af - ter any bit of data being shifted out, the cs# can be high. for the following instructions: wren, wrdi, wrsr, se, be, be32k, ce, pp, cp, 4pp, rdp, dp, wpsel, sblk, sbulk, gblk, gbulk, enso, exso, wrscur, enplm, explm, esry, dsry and clsr the cs# must go high exactly at the byte boundary; otherwise, the in - struction will be rejected and not executed. 6. during the progress of write status register, program, erase operation, to access the memory array is neglect - ed and not affect the current operation of write status register, program, erase. note: cpol indicates clock polarity of serial master, cpol=1 for sclk high while idle, cpol=0 for sclk low while not transmitting. cpha indicates clock phase. the combination of cpol bit and cpha bit decides which serial mode is supported. sclk msb cpha shift in shift out si 0 1 cpol 0 (serial mode 0) (serial mode 3) 1 so sclk msb
15 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 command description table 5. command sets command (byte) wren (write enable) wrdi (write disable) rdid (read identifcation) rdsr (read status register) wrsr (write status register) read (read data) fast read (fast read data) dread (1i 2o read) command (hex) 06 04 9f 05 01 03 0b 3b input cycles data(8) add(24) add(24) add(24) dummy cycles 8 8 action sets the (wel) write enable latch bit resets the (wel) write enable latch bit outputs jedec id: 1-byte manufacturer id & 2-byte device id to read out the values of the status register to write new values to the status register n bytes read out until cs# goes high n bytes read out until cs# goes high n bytes read out by dual output until cs# goes high command (byte) qread (1i 4o read) 4pp (quad page program) se (sector erase) be (block erase 64kb) be 32k (block erase 32kb) ce (chip erase) pp (page program) cp (continuously program mode) command (hex) 6b 38 20 d8 52 60 or c7 02 ad input cycles add(24) add(6)+ data(512) add(24) add(24) add(24) add(24)+ data(2048) add(24)+ data(16) dummy cycles 8 action n bytes read out by quad output until cs# goes high quad input to program the selected page to erase the selected sector to erase the selected 64kb block to erase the selected 32kb block to erase whole chip to program the selected page continously program whole chip, the address is automatically increase command (byte) dp (deep power down) rdp (release from deep power down) res (read electronic id) rems (read electronic manufacturer & device id) rems2 (read id for 2x i/o mode) rems4 (read id for 4x i/o mode) enso (enter secured otp) exso (exit secured otp) command (hex) b9 ab ab 90 ef df b1 c1 input cycles add(24) add(24) add(24) dummy cycles 24 action enters deep power down mode release from deep power down mode to read out 1-byte device id output the manufacturer id & device id output the manufacturer id & device id output the manufact- urer id & device id to enter the 4k-bit secured otp mode to exit the 4k- bit secured otp mode
16 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 note 1: it is not recommended to adopt any other code not in the command defnition table, which will potentially enter the hidden mode. note 2: in individual block write protection mode, all blocks/sectors is locked as defualt. command (byte) rdscur (read security register) wrscur (write security register) esry (enable so to output ry/ by#) dsry (disable so to output ry/ by#) enplm (enter parallel mode) explm (exit parallel mode) clsr (clear sr fail flags) wpsel (write protection selection) command (hex) 2b 2f 70 80 55 45 30 68 input cycles dummy cycles action to read value of security register to set the lock-down bit as "1" (once lock-down, cannot be updated) to enable so to output ry/ by# during cp mode to disable so to output ry/ by# during cp mode 8xi/o parallel program- ming mode to exit 8xi/ o parallel program- ming mode clear security register bit 6 and bit 5 to enter and enable individal block protect mode command (byte) sblk (single block lock) *note 2 sbulk (single block unlock) rdblock (block protect read) gblk (gang block lock) gbulk (gang block unlock) rdcfi (read cfi) command (hex) 36 39 3c 7e 98 5a input cycles add(24) add(24) add(24) add(24) dummy cycles 8 action individual block (64k- byte) or sector (4k- byte) write protect individual block (64k- byte) or sector (4k-byte) unprotect read individual block or sector write protect status whole chip write protect whole chip unprotect read cfi mode
17 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (1) write enable (wren) the write enable (wren) instruction is for setting write enable latch (wel) bit. for those instructions like pp, 4pp, cp, se, be, be32k, ce, wrsr, sblk, sbulk, gblk and gbulk, which are intended to change the device con - tent, should be set every time after the wren instruction setting the wel bit. the sequence of issuing wren instruction is: cs# goes low sending wren instruction code cs# goes high. (please refer to figure 8) (2) write disable (wrdi) the write disable (wrdi) instruction is for resetting write enable latch (wel) bit. the sequence of issuing wrdi instruction is: cs# goes low sending wrdi instruction code cs# goes high. (please refer to figure 9) the wel bit is reset by following situations: - power-up - write disable (wrdi) instruction completion - write status register (wrsr) instruction completion - page program (pp, 4pp) instruction completion - sector erase (se) instruction completion - block erase (be, be32k) instruction completion - chip erase (ce) instruction completion - continuously program mode (cp) instruction completion - single block lock/unlock (sblk/sbulk) instruction completion - gang block lock/unlock (gblk/gbulk) instruction completion (3) read identifcation (rdid) the rdid instruction is for reading the manufacturer id of 1-byte and followed by device id of 2-byte. the mxic manufacturer id is c2(hex), the memory type id is 20(hex) as the frst-byte device id, and the individual device id of second-byte id are listed as table of "id defnitions". (please refer to table 6) the sequence of issuing rdid instruction is: cs# goes low sending rdid instruction code 24-bits id data out on so to end rdid operation can use cs# to high at any time during data out. (please refer to figure 10) while program/erase operation is in progress, it will not decode the rdid instruction, so there's no effect on the cy - cle of program/erase operation which is currently in progress. when cs# goes high, the device is at standby stage.
18 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (4) read status register (rdsr) the rdsr instruction is for reading status register. the read status register can be read at any time (even in program/erase/write status register condition) and continuously. it is recommended to check the write in progress (wip) bit before sending a new instruction when a program, erase, or write status register operation is in progress. the sequence of issuing rdsr instruction is: cs# goes low sending rdsr instruction code status register data out on so (please refer to figure 11). the defnition of the status register bits is as below: wip bit. the write in progress (wip) bit, a volatile bit, indicates whether the device is busy in program/erase/write status register progress. when wip bit sets to 1, which means the device is busy in program/erase/write status register progress. when wip bit sets to 0, which means the device is not in progress of program/erase/write status register cycle. wel bit. the write enable latch (wel) bit, a volatile bit, indicates whether the device is set to internal write enable latch. when wel bit sets to "1", which means the internal write enable latch is set, the device can accept program/ erase/write status register instruction. when wel bit sets to 0, which means no internal write enable latch; the de - vice will not accept program/erase/write status register instruction. the program/erase command will be ignored and will reset wel bit if it is applied to a protected memory area. bp3, bp2, bp1, bp0 bits. the block protect (bp3, bp2, bp1, bp0) bits, non-volatile bits, indicate the protected area (as defned in table 2) of the device to against the program/erase instruction without hardware protection mode being set. to write the block protect (bp3, bp2, bp1, bp0) bits requires the write status register (wrsr) instruction to be executed. those bits defne the protected area of the memory to against page program (pp), sector erase (se), block erase (be) and chip erase (ce) instructions (only if all block protect bits set to 0, the ce instruction can be executed). qe bit. the quad enable (qe) bit, non-volatile bit, while it is "0" (factory default), it performs non-quad and wp# is enable. while qe is "1", it performs quad i/o mode and wp# is disabled. in the other word, if the system goes into four i/o mode (qe=1), the feature of hpm will be disabled. srwd bit. the status register write disable (srwd) bit, non-volatile bit, default value is "0". srwd bit is operat - ed together with write protection (wp#/sio2) pin for providing hardware protection mode. the hardware protection mode requires srwd sets to 1 and wp#/sio2 pin signal is low stage. in the hardware protection mode, the write status register (wrsr) instruction is no longer accepted for execution and the srwd bit and block protect bits (bp3, bp2, bp1, bp0) are read only. status register note 1: see the table 2 "protected area size" in page 11. bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 srwd (status register write protect) qe (quad enable) bp3 (level of protected block) bp2 (level of protected block) bp1 (level of protected block) bp0 (level of protected block) wel (write enable latch) wip (write in progress bit) 1=status register write disable 1= quad enable 0=not quad enable (note 1) (note 1) (note 1) (note 1) 1=write enable 0=not write enable 1=write operation 0=not in write operation non-volatile bit non-volatile bit non-volatile bit non-volatile bit non-volatile bit non-volatile bit volatile bit volatile bit
19 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (5) write status register (wrsr) the wrsr instruction is for changing the values of status register bits. before sending wrsr instruction, the write enable (wren) instruction must be decoded and executed to set the write enable latch (wel) bit in ad - vance. the wrsr instruction can change the value of block protect (bp3, bp2, bp1, bp0) bits to defne the pro - tected area of memory (as shown in table 2). the wrsr also can set or reset the quad enable (qe) bit and set or reset the status register write disable (srwd) bit in accordance with write protection (wp#/sio2) pin signal, but has no effect on bit1(wel) and bit0 (wip) of the status register. the wrsr instruction cannot be executed once the hardware protected mode (hpm) is entered. the sequence of issuing wrsr instruction is: cs# goes low sending wrsr instruction code status register data on si cs# goes high. (please refer to figure 12) the cs# must go high exactly at the byte boundary; otherwise, the instruction will be rejected and not executed. the self-timed write status register cycle time (tw) is initiated as soon as chip select (cs#) goes high. the write in progress (wip) bit still can be check out during the write status register cycle is in progress. the wip sets 1 during the tw timing, and sets 0 when write status register cycle is completed, and the write enable latch (wel) bit is reset. protection modes note: as defned by the values in the block protect (bp3, bp2, bp1, bp0) bits of the status register, as shown in table 2. as the above table showing, the summary of the software protected mode (spm) and hardware protected mode (hpm). software protected mode (spm): - when srwd bit=0, no matter wp#/sio2 is low or high, the wren instruction may set the wel bit and can change the values of srwd, bp3, bp2, bp1, bp0. the protected area, which is defned by bp3, bp2, bp1, bp0, is at software protected mode (spm). - when srwd bit=1 and wp#/sio2 is high, the wren instruction may set the wel bit can change the values of srwd, bp3, bp2, bp1, bp0. the protected area, which is defned by bp3, bp2, bp1, bp0, is at software pro - tected mode (spm) hardware protected mode (hpm): - when srwd bit=1, and then wp#/sio2 is low (or wp#/sio2 is low before srwd bit=1), it enters the hardware protected mode (hpm). the data of the protected area is protected by software protected mode by bp3, bp2, bp1, bp0 and hardware protected mode by the wp#/sio2 to against data modifcation. note: to exit the hardware protected mode requires wp#/sio2 driving high once the hardware protected mode is entered. if the wp#/sio2 pin is permanently connected to high, the hardware protected mode can never be entered; only can use software protected mode via bp3, bp2, bp1, bp0. if the system goes into four i/o mode, the feature of hpm will be disabled. mode status register condition wp# and srwd bit status memory software protection mode (spm) status register can be written in (wel bit is set to "1") and the srwd, bp0-bp3 bits can be changed wp#=1 and srwd bit=0, or wp#=0 and srwd bit=0, or wp#=1 and srwd=1 the protected area cannot be program or erase. hardware protection mode (hpm) the srwd, bp0-bp3 of status register bits cannot be changed wp#=0, srwd bit=1 the protected area cannot be program or erase.
20 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (6) read data bytes (read) the read instruction is for reading data out. the address is latched on rising edge of sclk, and data shifts out on the falling edge of sclk at a maximum frequency fr. the frst address byte can be at any location. the address is automatically increased to the next higher address after each byte data is shifted out, so the whole memory can be read out at a single read instruction. the address counter rolls over to 0 when the highest address has been reached. the sequence of issuing read instruction is: cs# goes low sending read instruction code3-byte address on si data out on so to end read operation can use cs# to high at any time during data out. (please refer to figure 13) (7) read data bytes at higher speed (fast_read) the fast_read instruction is for quickly reading data out. the address is latched on rising edge of sclk, and data of each bit shifts out on the falling edge of sclk at a maximum frequency fc. the frst address byte can be at any location. the address is automatically increased to the next higher address after each byte data is shifted out, so the whole memory can be read out at a single fast_read instruction. the address counter rolls over to 0 when the highest address has been reached. the sequence of issuing fast_read instruction is: cs# goes lowsending fast_read instruction code 3-byte address on si 1-dummy byte (default) address on si data out on so to end fast_read operation can use cs# to high at any time during data out. (please refer to figure 14) while program/erase/write status register cycle is in progress, fast_read instruction is rejected without any im - pact on the program/erase/write status register current cycle. (8) dual read mode (dread) the dread instruction enable double throughput of serial flash in read mode. the address is latched on rising edge of sclk, and data of every two bits (interleave on 2 i/o pins) shift out on the falling edge of sclk at a maxi - mum frequency ft. the frst address byte can be at any location. the address is automatically increased to the next higher address after each byte data is shifted out, so the whole memory can be read out at a single dread instruc - tion. the address counter rolls over to 0 when the highest address has been reached. once writing dread instruc - tion, the following data out will perform as 2-bit instead of previous 1-bit. the sequence of issuing dread instruction is: cs# goes low sending dread instruction 3-byte address on si 8-bit dummy cycle data out interleave on so1 & so0 to end dread operation can use cs# to high at any time during data out (please refer to figure 15 for dual read mode timing waveform). while program/erase/write status register cycle is in progress, dread instruction is rejected without any impact on the program/erase/write status register current cycle. (9) quad read mode (qread) the qread instruction enable quad throughput of serial flash in read mode. the address is latched on rising edge of sclk, and data of every four bits (interleave on 4 i/o pins) shift out on the falling edge of sclk at a maximum frequency fq. the frst address byte can be at any location. the address is automatically increased to the next high - er address after each byte data is shifted out, so the whole memory can be read out at a single qread instruction. the address counter rolls over to 0 when the highest address has been reached. once writing qread instruction,
21 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 the following data out will perform as 4-bit instead of previous 1-bit. the sequence of issuing qread instruction is: cs# goes low sending qread instruction 3-byte address on si 8-bit dummy cycle data out interleave on so3, so2, so1 & so0 to end qread operation can use cs# to high at any time during data out (please refer to figure 16 for quad read mode timing waveform). while program/erase/write status register cycle is in progress, qread instruction is rejected without any impact on the program/erase/write status register current cycle. (10) sector erase (se) the sector erase (se) instruction is for erasing the data of the chosen sector to be "1". the instruction is used for any 4k-byte sector. a write enable (wren) instruction must execute to set the write enable latch (wel) bit before sending the sector erase (se). any address of the sector (table 4-1 & 4-2) is a valid address for sector erase (se) instruction. the cs# must go high exactly at the byte boundary (the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not executed. the sequence of issuing se instruction is: cs# goes low sending se instruction code 3-byte address on si cs# goes high. (please refer to figure 17) the self-timed sector erase cycle time (tse) is initiated as soon as chip select (cs#) goes high. the write in progress (wip) bit still can be check out during the sector erase cycle is in progress. the wip sets 1 during the tse timing, and sets 0 when sector erase cycle is completed, and the write enable latch (wel) bit is reset. if the sector is protected by bp3~0 (wpsel=0) or by individual lock (wpsel=1), the array data will be protected (no change) and the wel bit still be reset. (11) block erase (be) the block erase (be) instruction is for erasing the data of the chosen block to be "1". the instruction is used for 64k-byte block erase operation. a write enable (wren) instruction must execute to set the write enable latch (wel) bit before sending the block erase (be). any address of the block (table 4-1 & 4-2) is a valid address for block erase (be) instruction. the cs# must go high exactly at the byte boundary (the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not executed. the sequence of issuing be instruction is: cs# goes low sending be instruction code 3-byte address on si cs# goes high. (please refer to figure 18) the self-timed block erase cycle time (tbe) is initiated as soon as chip select (cs#) goes high. the write in progress (wip) bit still can be check out during the sector erase cycle is in progress. the wip sets 1 during the tbe timing, and sets 0 when sector erase cycle is completed, and the write enable latch (wel) bit is reset. if the block is protected by bp3~0 (wpsel=0) or by individual lock (wpsel=1), the array data will be protected (no change) and the wel bit still be reset. (12) block erase (be32k) the block erase (be32) instruction is for erasing the data of the chosen block to be "1". the instruction is used for 32k-byte block erase operation. a write enable (wren) instruction must execute to set the write enable latch (wel) bit before sending the block erase (be32). any address of the block (table 4-1 & 4-2) is a valid address for block erase (be32) instruction. the cs# must go high exactly at the byte boundary (the latest eighth of address byte
22 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 been latched-in); otherwise, the instruction will be rejected and not executed. the sequence of issuing be32 instruction is: cs# goes low sending be32 instruction code 3-byte address on si cs# goes high. (please refer to figure 18) the self-timed block erase cycle time (tbe) is initiated as soon as chip select (cs#) goes high. the write in progress (wip) bit still can be check out during the sector erase cycle is in progress. the wip sets 1 during the tbe timing, and sets 0 when sector erase cycle is completed, and the write enable latch (wel) bit is reset. if the block is protected by bp3~0 (wpsel=0) or by individual lock (wpsel=1), the array data will be protected (no change) and the wel bit still be reset. (13) chip erase (ce) the chip erase (ce) instruction is for erasing the data of the whole chip to be "1". a write enable (wren) instruc - tion must execute to set the write enable latch (wel) bit before sending the chip erase (ce). the cs# must go high exactly at the byte boundary; otherwise, the instruction will be rejected and not executed. the sequence of issuing ce instruction is: cs# goes low sending ce instruction code cs# goes high. (please refer to figure 19) the self-timed chip erase cycle time (tce) is initiated as soon as chip select (cs#) goes high. the write in progress (wip) bit still can be check out during the chip erase cycle is in progress. the wip sets 1 during the tce timing, and sets 0 when chip erase cycle is completed, and the write enable latch (wel) bit is reset. if the chip is protected the chip erase (ce) instruction will not be executed, but wel will be reset. (14) page program (pp) the page program (pp) instruction is for programming the memory to be "0". a write enable (wren) instruction must execute to set the write enable latch (wel) bit before sending the page program (pp). the device programs only the last 256 data bytes sent to the device. if the entire 256 data bytes are going to be programmed, a7-a0 (the eight least signifcant address bits) should be set to 0. if the eight least signifcant address bits (a7-a0) are not all 0, all transmitted data going beyond the end of the current page are programmed from the start address of the same page (from the address a7-a0 are all 0). if more than 256 bytes are sent to the device, the data of the last 256-byte is programmed at the request page and previous data will be disregarded. if less than 256 bytes are sent to the device, the data is programmed at the requested address of the page without effect on other address of the same page. the sequence of issuing pp instruction is: cs# goes low sending pp instruction code 3-byte address on si at least 1-byte on data on si cs# goes high. ( please refer to figure 20) the cs# must be kept to low during the whole page program cycle; the cs# must go high exactly at the byte boundary( the latest eighth bit of data being latched in), otherwise, the instruction will be rejected and will not be executed. the self-timed page program cycle time (tpp) is initiated as soon as chip select (cs#) goes high. the write in progress (wip) bit still can be check out during the page program cycle is in progress. the wip sets 1 during the tpp timing, and sets 0 when page program cycle is completed, and the write enable latch (wel) bit is reset. if the page is protected by bp3~0 (wpsel=0) or by individual lock (wpsel=1), the array data will be protected (no change) and the wel bit will still be reset.
23 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (15) 4 x i/o page program (4pp) the quad page program (4pp) instruction is for programming the memory to be "0". a write enable (wren) instruction must execute to set the write enable latch (wel) bit and quad enable (qe) bit must be set to "1" before sending the quad page program (4pp). the quad page programming takes four pins: sio0, sio1, sio2, and sio3, which can raise programer performance and and the effectiveness of application of lower clock less than 20mhz. for system with faster clock, the quad page program cannot provide more actual favors, because the required internal page program time is far more than the time data fows in. therefore, we suggest that while executing this command (especially during sending data), user can slow the clock speed down to 20mhz below. the other function descriptions are as same as standard page program. the sequence of issuing 4pp instruction is: cs# goes low sending 4pp instruction code 3-byte address on sio[3:0] at least 1-byte on data on sio[3:0] cs# goes high. ( please refer to figure 21) if the page is protected by bp3~0 (wpsel=0) or by individual lock (wpsel=1), the array data will be protected (no change) and the wel bit will still be reset.
24 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 the program/erase function instruction function fow is as follows: program/erase flow(1) with read array data wren command program/erase command write program data/address (write erase address) rdsr command read array data (same address of pgm/ers) program/erase successfully yes yes program/erase fail no no start program/erase completed verify ok? wip=0? program/erase another block? yes no rdsr command* yes wren=1? no * * issue rdsr to check bp[3:0]. * if wpsel=1, issue rdblock to check the block status. clsr(30h) command
25 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 program/erase flow(2) without read array data wren command program/erase command write program data/address (write erase address) rdsr command rdscur command program/erase successfully yes no program/erase fail yes regpfail/regefail=1? wip=0? program/erase another block? yes no rdsr command* yes wren=1? no start no program/erase completed * issue rdsr to check bp[3:0]. * if wpsel=1, issue rdblock to check the block status. clsr(30h) command
26 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (16) continuously program mode (cp mode) the cp mode may enhance program performance by automatically increasing address to the next higher address after each byte data has been programmed. the continuously program (cp) instruction is for multiple byte program to flash. a write enable (wren) instruction must execute to set the write enable latch (wel) bit before sending the continuously program (cp) instruction. cs# requires to go high before cp instruction is executing. after cp instruction and address input, two bytes of data is input sequentially from msb(bit7) to lsb(bit0). the frst byte data will be programmed to the initial address range with a0=0 and second byte data with a0=1. if only one byte data is input, the cp mode will not process. if more than two bytes data are input, the additional data will be ignored and only two byte data are valid. any byte to be programmed should be in the erase state (ff) frst. it will not roll over during the cp mode, once the last unpro - tected address has been reached, the chip will exit cp mode and reset write enable latch bit (wel) as "0" and cp mode bit as "0". please check the wip bit status if it is not in write progress before entering next valid instruction. during cp mode, the valid commands are cp command (ad hex), wrdi command (04 hex), rdsr command (05 hex), and rdscur command (2b hex). and the wrdi command is valid after completion of a cp programming cy - cle, which means the wip bit=0. the sequence of issuing cp instruction is : cs# goes low sending cp instruction code 3-byte address on si pin two data bytes on si cs# goes high to low sending cp instruction and then continue two data bytes are programmed cs# goes high to low -> till last desired two data bytes are programmed cs# goes high to low sending wrdi (write disable) instruction to end cp mode send rdsr instruction to verify if cp mode word program ends, or send rdscur to check bit4 to verify if cp mode ends. (please refer to figure 22 of cp mode timing waveform) three methods to detect the completion of a program cycle during cp mode: 1) software method-i: by checking wip bit of status register to detect the completion of cp mode. 2) software method-ii: by waiting for a tbp time out to determine if it may load next valid command or not. 3) hardware method: by writing esry (enable so to output ry/by#) instruction to detect the completion of a program cycle during cp mode. the esry instruction must be executed before cp mode execution. once it is enable in cp mode, the cs# goes low will drive out the ry/by# status on so, "0" indicates busy stage, "1" indi - cates ready stage, so pin outputs tri-state if cs# goes high. dsry (disable so to output ry/by#) instruction to disable the so to output ry/by# and return to status register data output during cp mode. please note that the esry/dsry command are not accepted unless the completion of cp mode. if the page is protected by bp3~0 (wpsel=0) or by individual lock (wpsel=1), the array data will be protected (no change) and the wel bit will still be reset. (17) parallel mode (highly recommended for production throughputs increasing) the parallel mode provides 8 bit inputs/outputs for increasing throughputs of factory production purpose. the parallel mode requires 55h command code, after writing the parallel mode command and then cs# going high, after that, the memory can be available to accept rdid/res & rems/read/pp command as the normal writing command procedure. to exit parallel mode, it requires 45h command code, or power-off/on sequence. the sequence of issuing paralle mode instruction is : cs# goes lowsending parallel mode codecs# goes high ( please refer to figure 23-1, other parallel mode please refer to figure 23-2~23-7). a. for normal write command (by si), no effect b. under parallel mode, the fastest access clock freq. will be changed to 6mhz (sclk pin clock freq.) c. for parallel mode, the tv will be changed to 70ns.
27 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (18) deep power-down (dp) the deep power-down (dp) instruction is for setting the device on the minimizing the power consumption (to enter - ing the deep power-down mode), the standby current is reduced from isb1 to isb2). the deep power-down mode requires the deep power-down (dp) instruction to enter, during the deep power-down mode, the device is not ac - tive and all write/program/erase instruction are ignored. when cs# goes high, it's only in standby mode not deep power-down mode. it's different from standby mode. the sequence of issuing dp instruction is: cs# goes low sending dp instruction code cs# goes high. ( please refer to figure 24) once the dp instruction is set, all instruction will be ignored except the release from deep power-down mode (rdp) and read electronic signature (res) instruction. (those instructions allow the id being reading out). when power- down, the deep power-down mode automatically stops, and when power-up, the device automatically is in standby mode. for rdp instruction the cs# must go high exactly at the byte boundary (the latest eighth bit of instruction code been latched-in); otherwise, the instruction will not executed. as soon as chip select (cs#) goes high, a delay of tdp is required before entering the deep power-down mode and reducing the current to isb2. (19) release from deep power-down (rdp), read electronic signature (res) the release from deep power-down (rdp) instruction is terminated by driving chip select (cs#) high. when chip select (cs#) is driven high, the device is put in the standby power mode. if the device was not previously in the deep power-down mode, the transition to the standby power mode is immediate. if the device was previously in the deep power-down mode, though, the transition to the standby power mode is delayed by tres2, and chip select (cs#) must remain high for at least tres2(max), as specifed in table 10. once in the standby mode, the device waits to be selected, so that it can receive, decode and execute instructions. res instruction is for reading out the old style of 8-bit electronic signature, whose values are shown as table of id defnitions. this is not the same as rdid instruction. it is not recommended to use for new design. for new design, please use rdid instruction. even in deep power-down mode, the rdp and res are also allowed to be executed, only except the device is in progress of program/erase/write cycles; there's no effect on the current pro - gram/erase/write cycles in progress. the sequence is shown as figure 25, 26. the res instruction is ended by cs# goes high after the id been read out at least once. the id outputs repeat - edly if continuously send the additional clock cycles on sclk while cs# is at low. if the device was not previously in deep power-down mode, the device transition to standby mode is immediate. if the device was previously in deep power-down mode, there's a delay of tres2 to transit to standby mode, and cs# must remain to high at least tres2(max). once in the standby mode, the device waits to be selected, so it can be receive, decode, and execute instruction. the rdp instruction is for releasing from deep power-down mode. (20) read electronic manufacturer id & device id (rems), (rems2), (rems4) the rems, rems2 and rems4 instruction provides both the jedec assigned manufacturer id and the specifc device id. the instruction is initiated by driving the cs# pin low and shift the instruction code "90h", "cfh", "dfh" or "efh" fol - lowed by two dummy bytes and one bytes address (a7~a0). after which, the manufacturer id for mxic (c2h) and the device id are shifted out on the falling edge of sclk with most signifcant bit (msb) frst as shown in figure 27. the device id values are listed in table of id defnitions. if the one-byte address is initially set to 01h, then the de - vice id will be read frst and then followed by the manufacturer id. the manufacturer and device ids can be read continuously, alternating from one to the other. the instruction is completed by driving cs# high.
28 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 table 6. id defnitions command type mx25l6436e MX25L12836E rdid manufacturer id memory type memory density manufacturer id memory type memory density c2 20 17 c2 20 18 res electronic id electronic id 16 17 rems/rems2/ rems4 manufacturer id device id manufacturer id device id c2 16 c2 17 (21) enter secured otp (enso) the enso instruction is for entering the additional 4k-bit secured otp mode. the additional 4k-bit secured otp is independent from main array, which may use to store unique serial number for system identifer. after entering the secured otp mode, and then follow standard read or program, procedure to read out the data or update data. the secured otp data cannot be updated again once it is lock-down. the sequence of issuing enso instruction is: cs# goes low sending enso instruction to enter secured otp mode cs# goes high. please note that wrsr/wrscur/wpsel/sblk/gblk/sbulk/gbulk/ce/be/se/be32k commands are not ac - ceptable during the access of secure otp region, once security otp is lock down, only read related commands are valid. (22) exit secured otp (exso) the exso instruction is for exiting the additional 4k-bit secured otp mode. the sequence of issuing exso instruction is: cs# goes low sending exso instruction to exit secured otp mode cs# goes high. (23) read security register (rdscur) the rdscur instruction is for reading the value of security register. the read security register can be read at any time (even in program/erase/write status register/write security register condition) and continuously. the sequence of issuing rdscur instruction is : cs# goes low sending rdscur instruction security regis - ter data out on so cs# goes high. the defnition of the security register is as below: secured otp indicator bit. the secured otp indicator bit shows the chip is locked by factory before ex- factory or not. when it is "0", it indicates non-factory lock; "1" indicates factory-lock. lock-down secured otp (ldso) bit. by writing wrscur instruction, the ldso bit may be set to "1" for cus - tomer lock-down purpose. however, once the bit is set to "1" (lock-down), the ldso bit and the 4k-bit secured otp area cannot be update any more. while it is in 4k-bit secured otp mode, array access is not allowed.
29 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (24) write security register (wrscur) the wrscur instruction is for changing the values of security register bits. unlike write status register, the wren instruction is not required before sending wrscur instruction. the wrscur instruction may change the values of bit1 (ldso bit) for customer to lock-down the 4k-bit secured otp area. once the ldso bit is set to "1", the se - cured otp area cannot be updated any more. the sequence of issuing wrscur instruction is :cs# goes low sending wrscur instruction cs# goes high. the cs# must go high exactly at the boundary; otherwise, the instruction will be rejected and not executed. security register defnition bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0 wpsel e_fail p_fail continuously program mode (cp mode) x x ldso (lock-down 4k-bit se - cured otp) 4k-bit secured otp 0=normal wp mode 1=individual wp mode (default=0) 0=normal erase succeed 1=indicate erase failed (default=0) 0=normal program succeed 1=indicate program failed (default=0) 0=normal program mode 1=cp mode (default=0) reserved reserved 0 = not lockdown 1 = lock- down (cannot program/ erase otp) 0 = nonfactory lock 1 = factory lock non-volatile bit volatile bit volatile bit volatile bit volatile bit volatile bit non-volatile bit non-volatile bit otp read only read only read only read only read only otp read only continuously program mode( cp mode) bit. the continuously program mode bit indicates the status of cp mode, "0" indicates not in cp mode; "1" indicates in cp mode. program fail flag bit. while a program failure happened, the program fail flag bit would be set. this bit will also be set when the user attempts to program a protected main memory region or a locked otp region. this bit can in - dicate whether one or more of program operations fail, and can be reset by command clsr (30h). erase fail flag bit. while a erase failure happened, the erase fail flag bit would be set. this bit will also be set when the user attempts to erase a protected main memory region or a locked otp region. this bit can indicate whether one or more of erase operations fail, and can be reset by command clsr (30h). write protection select bit. the write protection select bit indicates that wpsel has been executed successfully. once this bit has been set (wpsel=1), all the blocks or sectors will be write-protected after the power-on every time. once wpsel has been set, it cannot be changed again, which means it's only for individual wp mode. under the individual block protection mode (wpsel=1), hardware protection is performed by driving wp#=0. once wp#=0 all array blocks/sectors are protected regardless of the contents of sram lock bits.
30 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (25) write protection selection (wpsel) there are two write protection methods, (1) bp protection mode (2) individual block protection mode. if wpsel=0, fash is under bp protection mode . if wpsel=1, fash is under individual block protection mode. the default value of wpsel is 0. wpsel command can be used to set wpsel=1. please note that wpsel is an otp bit. once wpsel is set to 1, there is no chance to recovery wpsel back to 0. if the fash is put on bp mode, the indi - vidual block protection mode is disabled. contrarily, if fash is on the individual block protection mode, the bp mode is disabled. every time after the system is powered-on, and the security register bit 7 is checked to be wpsel=1, all the blocks or sectors will be write protected by default. user may only unlock the blocks or sectors via sbulk and gbulk instruction. program or erase functions can only be operated after the unlock instruction is conducted. bp protection mode, wpsel=0: array is protected by bp3~bp0 and bp3~bp0 bits are protected by srwd=1 and wp#=0, where srwd is bit 7 of status register that can be set by wrsr command. individual block protection mode, wpsel=1: blocks are individually protected by their own sram lock bits which are set to 1 after power up. sbulk and sblk command can set sram lock bit to 0 and 1. when the system accepts and executes wpsel instruction, the bit 7 in security register will be set. it will activate sblk, sbulk, rdblock, gblk, gbulk etc instructions to conduct block lock protection and replace the original software protect mode (spm) use (bp3~bp0) indicated block meth - ods.under the individual block protection mode (wpsel=1), hardware protection is performed by driving wp#=0. once wp#=0 all array blocks/sectors are protected regardless of the contents of sram lock bits. the sequence of issuing wpsel instruction is: cs# goes low sending wpsel instruction to enter the individual block protect mode cs# goes high. (figure 28) wpsel instruction function fow is as follows: 64k b 64k b . . . 64k b 64k b bp 3 bp 2 bp 1 bp 0 s r w d w pb pi n bp and srwd if wpsel=0 (1) bp3~bp0 is used to defne the protection group region. (the protected area size see table2) (2) srwd=1 and wpb=0 is used to protect bp3~bp0. in this case, srwd and bp3~bp0 of status register bits can not be changed by wrsr
31 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 the individual block lock mode is effective after setting wpsel=1 64k b 4k b 64k b 4k b sra m sra m sra m 4k b 4k b sra m unifor m 64 kb b l oc k s s r a m s r a m 4k b sra m sbulk / sblk / gbul k / gblk / rdblock ?? ? ? ? ? ? ? bottom 4kbx1 6 sectors to p 4kbx16 sectors ? power-up: all sram bits=1 (all blocks are default protected). all array cannot be programmed/erased ? sblk/sbulk(36h/39h): - sblk(36h) : set sram bit=1 (protect) : array can not be programmed /erased - sbulk(39h): set sram bit=0 (unprotect): array can be programmed /erased - all top 4kbx16 sectors and bottom 4kbx16 sectors and other 64kb uniform blocks can be protected and unprotected sram bits individually by sblk/sbulk command set. ? gblk/ gbulk(78h/98h): - gblk(78h):set all sram bits=1,whole chip are protected and cannot be programmed / erased. - gbulk(98h):set all sram bits=0,whole chip are unprotected and can be programmed / erased. - all sectors and blocks sram bits of whole chip can be protected and unprotected at one time by gblk/gbulk command set. ? rdblock(3ch): - use rdblock mode to check the sram bits status after sbulk /sblk/gbulk/gblk command set.
32 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 wpsel flow rdscur(2bh) command rdsr command rdscur(2bh) command wpsel set successfully yes yes wpsel set fail no start wpsel=1? wip=0? no wpsel disable, block protected by bp[3:0] yes no wpsel=1? wpsel(68h) command wpsel enable. block protected by individual lock (sblk, sbulk, ? etc).
33 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 block lock flow rdscur(2bh) command start wren command sblk command ( 36h + 24bit address ) rdsr command rdblock command ( 3ch + 24bit address ) block lock successfully yes yes block lock fail no data = ffh ? wip=0? lock another block? block lock completed no yes no no yes wpsel=1? wpsel command (26) single block lock/unlock protection (sblk/sbulk) these instructions are only effective after wpsel was executed. the sblk instruction is for write protection a spec - ifed block (or sector) of memory, using a23-a16 or (a23-a12) address bits to assign a 64kbyte block (or 4k bytes sector) to be protected as read only. the sbulk instruction will cancel the block (or sector) write protection state. this feature allows user to stop protecting the entire block (or sector) through the chip unprotect command (gbulk). the wren (write enable) instruction is required before issuing sblk/sbulk instruction. the sequence of issuing sblk/sbulk instruction is: cs# goes low send sblk/sbulk (36h/39h) instruction send 3 address bytes assign one block (or sector) to be protected on si pin cs# goes high. (figure 29) the cs# must go high exactly at the byte boundary, otherwise the instruction will be rejected and not be executed. sblk/sbulk instruction function fow is as follows:
34 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 block unlock flow wren command rdscur(2bh) command sbulk command ( 39h + 24bit address ) rdsr command yes wip=0? unlock another block? yes no no yes unlock block completed? start wpsel=1? wpsel command
35 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 (27) read block lock status (rdblock) this instruction is only effective after wpsel was executed. the rdblock instruction is for reading the status of protection lock of a specifed block (or sector), using a23-a16 (or a23-a12) address bits to assign a 64k bytes block (4k bytes sector) and read protection lock status bit which the frst byte of read-out cycle. the status bit is"1" to indicate that this block has be protected, that user can read only but cannot write/program /erase this block. the status bit is "0" to indicate that this block hasn't be protected, and user can read and write this block. the sequence of issuing rdblock instruction is: cs# goes low send rdblock (3ch) instruction send 3 ad - dress bytes to assign one block on si pin read block's protection lock status bit on so pin cs# goes high. (please refer to figure 30) (28) gang block lock/unlock (gblk/gbulk) these instructions are only effective after wpsel was executed. the gblk/gbulk instruction is for enable/disable the lock protection block of the whole chip. the wren (write enable) instruction is required before issuing gblk/gbulk instruction. the sequence of issuing gblk/gbulk instruction is: cs# goes low send gblk/gbulk (7eh/98h) instruction cs# goes high. (please refer to figure 31) the cs# must go high exactly at the byte boundary, otherwise, the instruction will be rejected and not be executed. (29) clear sr fail flags (clsr) the clsr instruction is for resetting the program/erase fail flag bit of security register. it should be executed be - fore program/erase another block during programming/erasing fow without read array data. the sequence of issuing clsr instruction is: cs# goes low send clsr instruction code cs# goes high. the cs# must go high exactly at the byte boundary; otherwise, the instruction will be rejected and not executed. (30) enable so to output ry/by# (esry) the esry instruction is for outputing the ready/busy status to so during cp mode. the sequence of issuing esry instruction is: cs# goes low sending esry instruction code cs# goes high. the cs# must go high exactly at the byte boundary; otherwise, the instruction will be rejected and not executed. (31) disable so to output ry/by# (dsry) the dsry instruction is for resetting esry during cp mode. the ready/busy status will not output to so after dsry issued. the sequence of issuing dsry instruction is: cs# goes low send dsry instruction code cs# goes high.
36 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 the cs# must go high exactly at the byte boundary; otherwise, the instruction will be rejected and not executed. (32) read cfi mode (rdcfi) mx25l6436e/12836e features cfi mode. host system can retrieve the operating characteristics, structure and vendor-specifed information such as identifying information, memory size, operating voltages and timing informa - tion of this device by cfi mode. writes the cfi query command "5ah". the system can read cfi information at the addresses given. a reset command is required to exit cfi mode and go back to ready array mode. the system can write the cfi query command only when the device is in read mode. the identifcation data values in under tbd status. the sequence of issuing rdcfi instruction is cs# goes low send rdcfi (5a) instruction send 3 address bytes on si pin send 1 dummy byte on si pin read cfi code cs# goes high. cfi mode identifcation data value is under tbd.
37 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 power-on state the device is at below states when power-up: - standby mode ( please note it is not deep power-down mode) - write enable latch (wel) bit is reset the device must not be selected during power-up and power-down stage unless the vcc achieves below correct level: - vcc minimum at power-up stage and then after a delay of tvsl - gnd at power-down please note that a pull-up resistor on cs# may ensure a safe and proper power-up/down level. an internal power-on reset (por) circuit may protect the device from data corruption and inadvertent data change during power up state. for further protection on the device, if the vcc does not reach the vcc minimum level, the correct operation is not guaranteed. the read, write, erase, and program command should be sent after the time delay: - tvsl after vcc reached vcc minimum level the device can accept read command after vcc reached vcc minimum and a time delay of tvsl. please refer to the fgure of "power-up timing". note: - to stabilize the vcc level, the vcc rail decoupled by a suitable capacitor close to package pins is recommended. (generally around 0.1uf)
38 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 notice: 1. stresses greater than those listed under absolute maximum ratings may cause permanent damage to the device. this is stress rating only and functional operational sections of this specifcation is not implied. exposure to absolute maximum rating conditions for extended period may affect reliability. 2. specifcations contained within the following tables are subject to change. 3. during voltage transitions, all pins may overshoot vss to -2.0v and vcc to +2.0v for periods up to 20ns, see figure 2, 3. absolute maximum ratings electrical specifications capacitance ta = 25 c, f = 1.0 mhz figure 2. maximum negative overshoot waveform vss vss-2.0v 20ns 20ns 20ns figure 3. maximum positive overshoot waveform vcc + 2.0v vcc 20ns 20ns 20ns symbol parameter min. typ max. unit conditions cin input capacitance 6 pf vin = 0v cout output capacitance 8 pf vout = 0v rating value ambient operating temperature industrial grade -40c to 85c storage temperature -55c to 125c applied input voltage -0.5v to 4.6v applied output voltage -0.5v to 4.6v vcc to ground potential -0.5v to 4.6v
39 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 4. output loading device under test diodes=in3064 or eq uiv alent cl 6.2k ohm 2.7k ohm +3.3v cl=30/15pf including jig capacitance
40 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 table 7-1. mx25l6436e dc characteristics (temperature = -40 c to 85 c for industrial grade, vcc = 2.7v ~ 3.6v) notes : 1. typical values at vcc = 3.3v, t = 25c. these currents are valid for all product versions (package and speeds). 2. typical value is calculated by simulation. symbol parameter notes min. max. units test conditions ili input load current 1 2 ua vcc = vcc max, vin = vcc or gnd ilo output leakage current 1 2 ua vcc = vcc max, vin = vcc or gnd isb1 vcc standby current 1 100 ua vin = vcc or gnd, cs# = vcc isb2 deep power-down current 30 ua vin = vcc or gnd, cs# = vcc icc1 vcc read 1 45 ma f=104mhz, fq=75mhz (2 x i/o read) sclk=0.1vcc/0.9vcc, so=open 40 ma f=66mhz, ft=75mhz (4 x i/o read) sclk=0.1vcc/0.9vcc, so=open 30 ma f=33mhz, sclk=0.1vcc/0.9vcc, so=open icc2 vcc program current (pp) 1 25 ma program in progress, cs# = vcc icc3 vcc write status register (wrsr) current 20 ma program status register in progress, cs#=vcc icc4 vcc sector erase current (se) 1 25 ma erase in progress, cs#=vcc icc5 vcc chip erase current (ce) 1 20 ma erase in progress, cs#=vcc vil input low voltage -0.5 0.8 v vih input high voltage 0.7vcc vcc+0.4 v vol output low voltage 0.4 v iol = 1.6ma; iol = 140ua for parallel mode voh output high voltage vcc-0.2 v ioh = -100ua; ioh = 65ua for parallel mode
41 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 table 7-2. MX25L12836E dc characteristics (temperature = -40 c to 85 c for industrial grade, vcc = 2.7v ~ 3.6v) notes : 1. typical values at vcc = 3.3v, t = 25c. these currents are valid for all product versions (package and speeds). 2. typical value is calculated by simulation. symbol parameter notes min. max. units test conditions ili input load current 1 2 ua vcc = vcc max, vin = vcc or gnd ilo output leakage current 1 2 ua vcc = vcc max, vin = vcc or gnd isb1 vcc standby current 1 100 ua vin = vcc or gnd, cs# = vcc isb2 deep power-down current 40 ua vin = vcc or gnd, cs# = vcc icc1 vcc read 1 45 ma f=104mhz, fq=75mhz (2 x i/o read) sclk=0.1vcc/0.9vcc, so=open 40 ma f=66mhz, ft=75mhz (4 x i/o read) sclk=0.1vcc/0.9vcc, so=open 30 ma f=33mhz, sclk=0.1vcc/0.9vcc, so=open icc2 vcc program current (pp) 1 25 ma program in progress, cs# = vcc icc3 vcc write status register (wrsr) current 20 ma program status register in progress, cs#=vcc icc4 vcc sector erase current (se) 1 25 ma erase in progress, cs#=vcc icc5 vcc chip erase current (ce) 1 20 ma erase in progress, cs#=vcc vil input low voltage -0.5 0.8 v vih input high voltage 0.7vcc vcc+0.4 v vol output low voltage 0.4 v iol = 1.6ma; iol = 140ua for parallel mode voh output high voltage vcc-0.2 v ioh = -100ua; ioh = 65ua for parallel mode
42 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 table 8-1. mx25l6436e ac characteristics (temperature = -40 c to 85 c for industrial grade, vcc = 2.7v ~ 3.6v) symbol alt. parameter min. typ. max. unit fsclk fc clock frequency for the following instructions: fast_read, pp, se, be, ce, dp, res,rdp wren, wrdi, rdid, rdsr, wrsr 104 mhz frsclk fr clock frequency for read instructions 50 mhz ftsclk ft clock frequency for dread instructions 70 mhz fq clock frequency for qread instructions 70 mhz f4pp clock frequency for 4pp (quad page program) 20 mhz tch(1) tclh clock high time fast_read 4.5 ns read 9 ns tcl(1) tcll clock low time fast_read 4.5 ns read 9 ns tclch(2) clock rise time (3) (peak to peak) 0.1 v/ns tchcl(2) clock fall time (3) (peak to peak) 0.1 v/ns tslch tcss cs# active setup time (relative to sclk) 8 ns tchsl cs# not active hold time (relative to sclk) 5 ns tdvch tdsu data in setup time 2 ns tchdx tdh data in hold time 5 ns tchsh cs# active hold time (relative to sclk) 5 ns tshch cs# not active setup time (relative to sclk) 8 ns tshsl(3) tcsh cs# deselect time read 15 ns write/erase/ program 50 ns tshqz(2) tdis output disable time 2.7v-3.6v 10 ns 3.0v-3.6v 8 ns tclqv tv clock low to output valid vcc=2.7v~3.6v loading: 15pf 1 i/o 9 ns 2 i/o & 4 i/o 9.5 ns loading: 30pf 2 i/o & 4 i/o 12 ns tclqx tho output hold time 2 ns twhsl(4) write protect setup time 20 ns tshwl(4) write protect hold time 100 ns tdp(2) cs# high to deep power-down mode 10 us tres1(2) cs# high to standby mode without electronic signature read 100 us tres2(2) cs# high to standby mode with electronic signature read 100 us tw write status register cycle time 40 100 ms tbp byte-program 9 300 us tpp page program cycle time 1.4 5 ms tse sector erase cycle time (4kb) 60 300 ms tbe block erase cycle time (32kb) 0.5 2 s tbe block erase cycle time (64kb) 0.7 2 s tce chip erase cycle time 50 80 s twps write protection selection time 1 ms twsr write security register time 1 ms notes: 1. tch + tcl must be greater than or equal to 1/ fc. 2. value guaranteed by characterization, not 100% tested in production. 3. only applicable as a constraint for a wrsr instruction when srwd is set at 1.
43 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 table 8-2. MX25L12836E ac characteristics (temperature = -40 c to 85 c for industrial grade, vcc = 2.7v ~ 3.6v) symbol alt. parameter min. max. unit fsclk fc clock frequency for the following instructions: fast_read, pp, se, be, ce, dp, res, rdp, wren, wrdi, rdid, rdsr, wrsr serial 104 mhz parallel 6 mhz frsclk fr clock frequency for read instructions 50 mhz ftsclk ft clock frequency for dread instructions 70 mhz fq clock frequency for qread instructions 70 mhz f4pp clock frequency for 4pp (quad page program) 20 mhz tch(1) tclh clock high time serial 4.5 (fast_read) ns serial 9 (read) ns parallel 30 ns tcl(1) tcll clock low time serial 4.5 (fast_read) ns serial 9 (read) ns parallel 30 ns tclch(2) clock rise time (3) (peak to peak) serial 0.1 v/ns parallel 0.25 v/ns tchcl(2) clock fall time (3) (peak to peak) serial 0.1 v/ns parallel 0.25 v/ns tslch tcss cs# active setup time (relative to sclk) 8 ns tchsl cs# not active hold time (relative to sclk) 5 ns tdvch tdsu data in setup time serial 2 ns parallel 10 ns tchdx tdh data in hold time serial 5 ns parallel 10 ns tchsh cs# active hold time (relative to sclk) serial 5 ns parallel 30 ns tshch cs# not active setup time (relative to sclk) 8 ns tshsl(3) tcsh cs# deselect time read 15 ns write/erase/ program 50 ns tshqz(2) tdis output disable time 2.7v-3.6v serial 10 ns 3.0v-3.6v serial 8 ns parallel 20 ns tclqv tv clock low to output valid vcc=2.7v~3.6v loading: 15pf 1 i/o 9 ns 2 i/o & 4 i/o 9.5 ns loading: 30pf 2 i/o & 4 i/o 12 ns parallel 70 ns
44 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 notes: 1. tch + tcl must be greater than or equal to 1/ fc. 2. value guaranteed by characterization, not 100% tested in production. 3.only applicable as a constraint for a wrsr instruction when srwd is set at 1. symbol alt. parameter min. typ. max. unit tclqx tho output hold time 2 ns twhsl(4) write protect setup time 20 ns tshwl(4) write protect hold time 100 ns tdp(2) cs# high to deep power-down mode 10 us tres1(2) cs# high to standby mode without electronic signature read 100 us tres2(2) cs# high to standby mode with electronic signature read 100 us tw write status register cycle time 40 100 ms tbp byte-program 9 300 us tpp page program cycle time 1.4 5 ms tse sector erase cycle time (4kb) 60 300 ms tbe block erase cycle time (32kb) 0.5 2 s tbe block erase cycle time (64kb) 0.7 2 s tce chip erase cycle time 80 200 s twps write protection selection time 1 ms twsr write security register time 1 ms
45 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 5. serial input timing figure 6. output timing timing analysis sclk si cs# msb so tdvch high-z lsb tslch tchdx tchcl tclch tshch tshsl tchsh tchsl lsb addr.lsb in tshqz tch tcl tqlqh tqhql tclqx tclqv tclqx tclqv sclk so cs# si
46 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 7. wp# setup timing and hold timing during wrsr when srwd=1 figure 8. write enable (wren) sequence (command 06) figure 9. write disable (wrdi) sequence (command 04) 2 1 34567 high-z 0 04 sclk si cs# so command 2 1 34567 high-z 0 06 command sclk si cs# so high-z 01 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 twhsl tshwl sclk si cs# wp# so
47 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 10. read identifcation (rdid) sequence (command 9f) 2 1 3456789 10 11 12 13 14 15 0 manufacturer identification high-z msb device identification msb d7 d15 d14 d13 d6 d5 d3 d3 d2 d2 d1 d1 d0 d0 d4 16 17 18 28 29 30 31 sclk si cs# so 9f command figure 11. read status register (rdsr) sequence (command 05) figure 12. write status register (wrsr) sequence (command 01) 2 1 3456789 10 11 12 13 14 15 command 0 d7 d6 d5 d4 d3 d2 d1 d0 status register out high-z msb sclk si cs# so 05 2 1 3456789 10 11 12 13 14 15 status register in 0 msb sclk si cs# so 01 high-z command d7 d6 d5 d4 d3 d2 d1 d0
48 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 13. read data bytes (read) sequence (command 03) sclk si cs# so 2 1 3456789 10 28 29 30 31 32 33 34 35 36 37 38 data out 1 24 add cycles 0 msb msb msb 39 data out 2 03 high-z command d7 a23 a22 a21 a3 a2 a1 a0 d7 d6 d5 d4 d3 d2 d1 d0 figure 14. read at higher speed (fast_read) sequence (command 0b) 2 1 3456789 10 28 29 30 31 high-z 0 32 33 34 36 37 38 39 40 41 42 43 44 45 46 8 dummy cycles msb 47 35 sclk si cs# so 0b command d7 d7 d6 d5 d4 d3 d2 d1 d0 data out 1 data out 2 24 add cycles a23 a22 a21 a3 a2 a1 a0 figure 15. dual read mode sequence (command 3b) high impedance 2 1 345678 0 sclk si/sio0 so/sio1 cs# 9 30 31 32 39 40 41 43 44 45 42 3b d4 d5 d2 d3 d7 d6 d6 d4 d0 d7 d5 d1 command 24 add cycle 8 dummy cycle a22 a21 a2 a0 ? ? ? data out 1 data out 2
49 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 16. quad read mode sequence (command 6b) high impedance 2 1 345678 0 sclk si/so0 so/so1 cs# 29 9 30 31 32 33 38 39 40 41 42 6b high impedance wp#/so2 high impedance nc/so3 8 dummy cycles d4 d0 d5 d1 d6 d2 d7 d3 d4 d0 d5 d1 d6 d2 d7 d3 d4 d5 d6 d7 a23 a22 a2 a1 a0 command 24 add cycles data out 1 data out 2 data out 3 ? ? ? figure 17. sector erase (se) sequence (command 20) figure 18. block erase (be/eb32k) sequence (command d8/52) 2 1 3456789 29 30 31 0 msb sclk cs# si 20 command 24 add cycles a23 a22 a2 a1 a0 ? ? 2 1 3456789 29 30 31 0 msb sclk cs# si d8/52 command 24 add cycles a23 a22 a2 a1 a0 b b
50 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 19. chip erase (ce) sequence (command 60 or c7) 2 1 34567 0 60 or c7 sclk si cs# command figure 20. page program (pp) sequence (command 02) 2 1 3456789 10 28 29 30 31 32 33 34 35 36 37 38 24 add cycles 0 data byte 1 39 data byte 256 2079 2078 2077 2076 2075 2074 2073 2072 msb msb sclk cs# si 02 command d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 a23 a22 a21 a3 a2 a1 a0 figure 21. 4 x i/o page program (4pp) sequence (command 38) a20 a16 a12 a8 a4 a0 a21 a17 a13 a9 a5 a1 a22 a18 a14 a10 a6 a2 a23 a19 a15 a11 a7 a3 2 1 3456789 6 add cycles data byte 1 data byte 2 data byte 256 0 sclk cs# si/sio0 so/sio1 nc/sio3 wp#/sio2 38 command 10 11 12 13 14 15 16 17 524 525 ? ? ? ? ? d4 d0 d5 d1 d6 d2 d7 d3 d4 d0 d5 d1 d6 d2 d7 d3 d4 d0 d5 d1 d6 d2 d7 d3
51 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 22. continuously program (cp) mode sequence with hardware detection (command ad) note: (1) during cp mode, the valid commands are cp command (ad hex), wrdi command (04 hex), rdsr command (05 hex), and rdscur command (2b hex). (2) once an internal programming operation begins, cs# goes low will drive the status on the so pin and cs# goes high will return the so pin to tri-state. (3) to end the cp mode, either reaching the highest unprotected address or sending write disable (wrdi) com - mand (04 hex) may achieve it and then it is recommended to send rdsr command (05 hex) to verify if cp mode is ended. cs# sclk 0 1 6 7 8 9 si command ad (hex) 30 31 31 s0 high impedance 32 47 48 status (2) data in 24-bit address byte 0, byte1 0 1 valid command (1) data in byte n-1, byte n 6 7 8 20 21 22 23 0 04 (hex) 24 7 0 7 05 (hex) 8
52 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 23-1. enter parallel mode (enplm) sequence (command 55) 2 1 34567 high-z 0 55 command sclk si cs# so figure 23-2. exit parallel mode (explm) sequence (command 45) 2 1 34567 high-z 0 45 sclk si cs# so command figure 23-3. parallel mode read identifcation (parallel rdid) sequence (command 9f) 2 0 1 3 4 5 6 7 8 9 10 manufacturer identification high-z device identification sclk si cs# po7~0 9f command notes : 1. there are 3 data bytes which would be output sequentially for manufacturer and device id 1'st byte (memory type) and device id 2'nd byte (memory density).
53 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 23-4. parallel mode read electronic manufacturer & device id (parallel rems) sequence (command 90) 2 1 3456789 10 0 sclk si cs# po7~0 90 high-z command 24 add cycles a23 a22 a21 a2 a3 a1 a0 31 32 33 30 28 29 manufacturer identification device identification notes : 1. a0=0 will output the manufacturer id frst and a0=1 will output device id frst. a1~a23 don't care. figure 23-5. parallel mode release from deep power-down (rdp) and read electronic signature (res) se - quence 2 1 3456789 10 28 29 30 31 32 33 34 35 36 37 38 high impedance electronic signature out instruction 0 byte output stand-by mode deep power-down mode t res2 sclk cs# si po7~0 24 add cycles ab a23 a22 a21 a3 a2 a1 a0 notes : 1. under parallel mode, the fastest access clock freg. will be changed to 6mhz(sclk pin clock freg.) to release from deep power-down mode and read id in parallel mode, which requires a parallel mode com - mand (55h) before the read status register command. to exit parallel mode, it requires a (45h) command or power-off/on sequence.
54 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 23-6. parallel mode read array (parallel read) sequence (command 03) high-z 24 add cycles msb sclk cs# si po7~0 03 command a23 a22 a21 a3 a2 a1 a0 n 33 32 31 30 29 28 10 9 8 7 6 5 4 3 2 1 0 n-1 ? d0~d7 byte 1 d0~d7 byte 2 d0~d7 byte n d0~d7 byte n-1 ? ? figure 23-7. parallel mode page program (parallel pp) sequence (command 02) sclk si cs# po7~0 24 add cycles msb msb 02 high-z command data byte1 data byte255 data byte256 data byte2 data byte3 a23 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 286 287 a22 a21 a3 a2 a1 a0 ? ? figure 24. deep power-down (dp) sequence (command b9) 2 1 34567 0 t dp deep power-down mode stand-by mode sclk cs# si b9 command
55 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 26. release from deep power-down (rdp) sequence (command ab) 2 1 34567 0 t res1 stand-by mode deep power-down mode high-z sclk cs# si so ab command figure 25. release from deep power-down and read electronic signature (res) sequence (command ab) 2 1 3456789 10 28 29 30 31 32 33 34 35 36 37 38 high-z electronic signature out 24 add cycles 0 msb stand-by mode deep power-down mode msb t res2 sclk cs# si so ab command a23 a22 a21 a3 a2 a1 a0 ? d7 d6 d5 d4 d3 d2 d1 d0 39
56 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 notes: 1. a0=0 will output the manufacturer id frst and a0=1 will output device id frst. a1~a23 is don't care. 2. instruction is either 90(hex) or ef(hex) or df(hex) or cf(hex). figure 27. read electronic manufacturer & device id (rems) sequence (command 90 or ef or df or cf) 2 1 3456789 10 0 32 33 34 36 37 38 39 40 41 42 43 44 45 46 manufacturer id msb device id msb msb 47 35 sclk si cs# so 90 high-z command 24 add cycles a23 a22 a21 a2 a3 a1 a0 d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 31 30 28 29 figure 28. write protection selection (wpsel) sequence (command 68) 2 1 34567 0 68 sclk si cs# command
57 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 29. single block lock/unlock protection (sblk/sbulk) sequence (command 36/39) figure 30. read block protection lock status (rdblock) sequence (command 3c) 24 bit address cycles 2 1 3456789 29 30 31 0 msb sclk cs# si 36/39 command a23 a22 a2 a1 a0 2 1 3456789 10 28 29 30 31 32 33 34 35 36 37 38 high-z block protection lock status out 24 add cycles 0 msb msb sclk cs# si so 3c command a23 a22 a21 a3 a2 a1 a0 d7 d6 d5 d4 d3 d2 d1 d0 39 figure 31. gang block lock/unlock (gblk/gbulk) sequence (command 7e/98) 2 1 34567 0 7e/98 sclk si cs# command
58 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 figure 32. power-up timing note: vcc (max.) is 3.6v and vcc (min.) is 2.7v. initial delivery state the device is delivered with the memory array erased: all bits are set to 1 (each byte contains ffh). the status register contains 00h (all status register bits are 0). note: 1. the parameter is characterized only. table 9. power-up timing v cc v cc (min) chip selection is not allowed tvsl time device is fully accessible v cc (max) symbol parameter min. max. unit tvsl(1) vcc(min) to cs# low 300 us
59 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 recommended operating conditions at device power-up ac timing illustrated in figure a is recommended for the supply voltages and the control signals at device power-up. if the timing in the fgure is ignored, the device may not operate correctly . figure a. ac timing at device power-up notes : 1. sampled, not 100% tested. 2. for ac spec tchsl, tslch, tdvch, tchdx, tshsl, tchsh, tshch, tchcl, tclch in the fgure, please refer to "ac characteristics" table. sclk si cs# vcc msb in so tdvch high impedance lsb in tslch tchdx tchcl tclch tshch tshsl tchsh tchsl tvr vcc(min) gnd symbol parameter notes min. max. unit tvr vcc rise time 1 20 500000 us/v
60 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 erase and programming performance note: 1. typical program and erase time assumes the following conditions: 25c, 3.3v, and checker board pattern. 2. under worst conditions of 85c and 2.7v. 3. system-level overhead is the time required to execute the frst-bus-cycle sequence for the programming com - mand. 4. the maximum chip programming time is evaluated under the worst conditions of 0c, vcc=3.0v, and 100k cy - cle with 90% confdence level. latch-up characteristics min. max. input voltage with respect to gnd on all power pins, si, cs# -1.0v 2 vccmax input voltage with respect to gnd on so -1.0v vcc + 1.0v current -100ma +100ma includes all pins except vcc. test conditions: vcc = 3.0v, one pin at a time. parameter typ. (1) max. (2) unit write status register cycle time 40 100 ms sector erase time (4kb) 60 300 ms block erase time (64kb) 0.7 2 s block erase time (32kb) 0.5 2 s chip erase time 64mb 50 80 s 128mb 80 200 s byte program time (via page program command) 9 300 us page program time 1.4 5 ms erase/program cycle 100,000 cycles data retention parameter condition min. max. unit data retention 55?c 20 years
61 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 ordering information part no. clock (mhz) operating current max. (ma) standby current max. (ua) temperature package remark mx25l6436em2i-10g 104 45 100 -40c~85c 8-sop (200mil) pb-free part no. clock (mhz) operating current max. (ma) standby current max. (ua) temperature package remark MX25L12836Emi-10g 104 45 100 -40c~85c 16-sop (300mil) pb-free 128mb 64mb
62 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 part name description mx 25 l m i tempera ture range: i: industr ial (-40 c to 85 c) package: m: 300mil 16-sop m2: 200mil 8-sop density & mode: 12836e: 128mb standard type 6436e: 64mb standard type type: l: 3v device: 25: ser ial flash 12836e 10 g option: g: pb-free speed: 10: 104mhz
63 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009 package information
64 mx25l6436e MX25L12836E p/n: pm1514 rev. 1.0, jul. 29, 2009
65 m acronix i nternational c o., l td. macronix offces : taiwan headquarters, fab2 macronix, international co., ltd. 16, li-hsin road, science park, hsinchu, taiwan, r.o.c. tel: +886-3-5786688 fax: +886-3-5632888 taipei offce macronix, international co., ltd. 19f, 4, min-chuan e. road, sec. 3, taipei, taiwan, r.o.c. tel: +886-2-2509-3300 fax: +886-2-2509-2200 macronix offces : china macronix (hong kong) co., limited. 702-703, 7/f, building 9, hong kong science park, 5 science park west avenue, sha tin, n.t. tel: +86-852-2607-4289 fax: +86-852-2607-4229 macronix (hong kong) co., limited, suzhou offce no.5, xinghai rd, suzhou industrial park, suzhou china 215021 tel: +86-512-62580888 ext: 3300 fax: +86-512-62586799 macronix (hong kong) co., limited, shenzhen offce room 1401 & 1404, block a, tianan hi-tech plaza tower, che gong miao, futiandistrict, shenzhen prc 518040 tel: +86-755-83433579 fax: +86-755-83438078 http : //www.macronix.com macronix international co., ltd. reserves the right to change product and specifcations without notice. macronix offces : japan macronix asia limited. nkf bldg. 5f, 1-2 higashida-cho, kawasaki-ku kawasaki-shi, kanagawa pref. 210-0005, japan tel: +81-44-246-9100 fax: +81-44-246-9105 macronix offces : korea macronix asia limited. #906, 9f, kangnam bldg., 1321-4, seocho-dong, seocho-ku, 135-070, seoul, korea tel: +82-02-588-6887 fax: +82-02-588-6828 macronix offces : singapore macronix pte. ltd. 1 marine parade central, #11-03 parkway centre, singapore 449408 tel: +65-6346-5505 fax: +65-6348-8096 macronix offces : europe macronix europe n.v. koningin astridlaan 59, bus 1 1780 wemmel belgium tel: +32-2-456-8020 fax: +32-2-456-8021 macronix offces : usa macronix america, inc. 680 north mccarthy blvd. milpitas, ca 95035, u.s.a. tel: +1-408-262-8887 fax: +1-408-262-8810 macronix's products are not designed, manufactured, or intended for use for any high risk applications in which the failure of a single component could cause death, personal injury, severe physical damage, or other substan - tial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft and military application. macronix and its suppliers will not be liable to you and/or any third party for any claims, injuries or damages that may be incurred due to use of macronix's products in the prohibited applications. copyright? macronix international co., ltd. 2009. all rights reserved. macronix, mxic, mxic logo, mx logo, mxsmio, are trademarks or registered trademarks of macronix international co., ltd.. the names and brands of other companies are for identifcation purposes only and may be claimed as the property of the respective companies. mx25l6436e MX25L12836E

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